Title :
ALX permanent polymer dielectrics for microelectronic packaging applications
Author :
Garrou, Philip ; Huffman, Alan ; Piascik, Jeffery
Author_Institution :
Microelectron. Consultants of NC, Research Triangle Park, NC, USA
Abstract :
In this paper we present the results of a study done to compare the new Asahi Glass ALX polymers with other microelectronic polymers in typical WLP structures. We present property data on ALX-211, including spin speed curves and resolution plots, planarization, thermal stability and stress data and adhesion as evaluated using polymer bump shear testing. We have examined the processing of ALX-211 and developed a standard process flow for these materials. We have used ALX-211 in a typical bump-on-polymer process flow, with eutectic Sn/Pb solder bumps, and compared its performance to that of BCB through solder bump shear testing.
Keywords :
adhesion; dielectric materials; integrated circuit packaging; internal stresses; planarisation; polymers; thermal stability; ALX permanent polymer dielectrics; ALX-211; Asahi Glass ALX polymers; WLP structures; adhesion; bump-on-polymer process flow; eutectic Sn-Pb solder bumps; microelectronic packaging; planarization; polymer bump shear testing; resolution plots; spin speed curves; stress property; thermal stability; Adhesives; Dielectrics; Glass; Microelectronics; Packaging; Planarization; Polymers; Testing; Thermal stability; Thermal stresses; ALX; WLP; bump-on-polymer; photo polymer;
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
