DocumentCode
503095
Title
SMD pressure and flow sensors for industrial compressed air in LTCC technology
Author
Fournier, Yannick ; Barras, A. ; Rouelle, G. Boutinard ; Maeder, T. ; Ryser, P.
Author_Institution
Lab. de Production Microtech. (LPM), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear
2009
fDate
15-18 June 2009
Firstpage
1
Lastpage
7
Abstract
In this work, we propose an SMD (surface mount device) pressure sensor in LTCC technology specially designed for standard industrial compressed air. It combines the measurement of pressure and temperature, with its integrated signal conditioning electronics for linearization, adjustment and temperature compensation. For the first time, such a sensor can be mounted on an integrated electro-fluidic platform like a standard component using surface mount technology, obviating the need for both wires and tubes. Manufacturing of the SMD sensor is described, as well as its performance and limitations. Furthermore, a proposal for an anemometric flow sensor is described. The heating/sensing elements of the sensor consist of PTC co-fired resistors suspended on bridges across the fluidic channel; different geometric and processing variants have been manufactured for tests. In the future, we intend to integrate this flow measurement function and corresponding electronics to the pressure sensor, resulting in an all-in-one integrated industrial compressed air flow -pressure - temperature sensor.
Keywords
anemometry; flow sensors; pressure sensors; temperature sensors; SMD sensor; all-in-one integrated industrial compressed airflow -pressure-temperature sensor; anemometric flow sensor; co-fired resistors; flow measurement function; fluidic channel; heating-sensing elements; industrial compressed air; integrated electro-fluidic platform; low-temperature co-fired ceramic technology; pressure sensor; surface mount device; temperature compensation; Heating; Manufacturing; Pressure measurement; Proposals; Resistors; Sensor phenomena and characterization; Surface-mount technology; Temperature sensors; Thermal sensors; Wires; LTCC; SMD; flow; pressure; sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location
Rimini
Print_ISBN
978-1-4244-4722-0
Electronic_ISBN
978-0-6152-9868-9
Type
conf
Filename
5272856
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