Electromagnetic simulations for the packaging design of telecommunication component

This paper describes the use of a fully 3D electromagnetic simulator for designing a complete packaging solution for a telecommunication component. Typically the electromagnetic simulators are used to evaluate the RF performances and for improving the electronic design. N or approach we use the software as a tool for evaluating the overall packaging solution and for improving the complete packaging architecture. Several simulations have been performed to evaluate the feed through, the connection to PCB and the PCB itself. First of all each part has been optimized separately and finally the whole RF chain has been simulated. The results have been used to compare a standard gull wing leaded package and a leadless package. In the second case the connection to PCB is realized by a flex substrate, which is more performing according to the simulation. The electromagnetic simulator has been used to evaluate the Electro-Magnetic Interference (EMI), the influence of length and number of wires and the use of ribbon in place of wire bonding. Also a detailed analysis of the process tolerance has been carried out. As results, we have obtained a S11 parameter (reflected signal) lower than -10 dB and s21 (transmitted signal) higher than -1.5 dB over a 20 GHz bandwidth. These results are compliant with the typical requirements for HF telecommunication modules. Using the 3D simulator as a packaging tool permits to realize a virtual prototyping. In this way it´s possible to analyze different configurations saving time and money.