Versatile MEMS and mems integration technology platforms for cost effective MEMS development

Author

Pieters, Philip

Author_Institution

IMEC, Leuven, Belgium

fYear

2009

fDate

15-18 June 2009

Firstpage

1

Lastpage

5

Abstract

For fast and cost effective development of novel MEMS devices, it is advantageous to start from advanced and stable MEMS technology platforms. IMEC offers such platforms for post-CMOS MEMS integration, RF-MEMS, MEMS interconnection and packaging and for Si-photonics. In this paper these versatile MEMS technology platforms together with various examples are described. In IMEC´s CMORE offering, not only technology development but also prototyping and small volume production becomes possible.

Keywords

costing; integrated circuit packaging; integration; interconnections; micromechanical devices; radiofrequency integrated circuits; IMEC; MEMS development; MEMS integration technology; MEMS interconnection; MEMS packaging; RF-MEMS; cost effective; CMOS process; CMOS technology; Costs; Integrated circuit interconnections; Integrated circuit technology; Microelectromechanical devices; Micromechanical devices; Packaging; Radiofrequency microelectromechanical systems; Temperature; MEMS integration; MEMS packaging; RF MEMS; photonics; post-CMOS MEMS;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Conference_Location

Rimini

Print_ISBN

978-1-4244-4722-0

Electronic_ISBN

978-0-6152-9868-9

Type

conf

Filename

5272938