• DocumentCode
    503187
  • Title

    Packaging of silicon photonic devices: Grating structures for high efficiency coupling and a solution for standard integration

  • Author

    Galan, J.V. ; Griol, A. ; Hurtado, J. ; Sanchis, P. ; Preve, G.B. ; Håkansson, A. ; Marti, J.

  • Author_Institution
    INanophotonics Technol. Center, Univ. Politec. de Valencia, Valencia, Spain
  • fYear
    2009
  • fDate
    15-18 June 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Efficient packaging in silicon photonics requires a previous development of high performance fiber coupling structures. One of the most suitable fiber coupling structures in silicon is the grating coupler. Main advantages of using such a vertical coupling technique with respect to horizontal techniques are fiber alignment tolerances and wafer scale testing. We report design, fabrication and experimental measurements of conventional SOI grating couplers. Around 40% coupling efficiency is obtained when coupling a standard singlemode fiber to a singlemode SOI waveguide with 250 nmtimes500 nm section dimensions, with a fiber tilt angle of 10deg. With respect to alignment tolerances, the variation effect of different fiber positions in the grating plane was evaluated as well as different tilt angles. It was obtained that coupling efficiency is almost constant for angle errors of plusmn2deg. In addition, a tolerance of fiber position deviations of about plusmn2 mum was reached, making possible multifiber alignments with the use of standard fiber-arrays. As the obtained vertical orientation is not always easy to adapt to standard layouts, we also introduce here a solution for allowing the use of standard DIL or butterfly packages with horizontal orientation, illustrating the design concepts and briefly describing the technologies involved.
  • Keywords
    diffraction gratings; elemental semiconductors; integrated optoelectronics; optical arrays; optical design techniques; optical fibre couplers; optical fibre fabrication; semiconductor device packaging; silicon; silicon-on-insulator; wafer-scale integration; SOI grating coupler design; Si; Si-SiO2; butterfly packages; fiber coupling structure; grating structures; silicon photonic device packaging; singlemode SOI waveguide fabrication; standard fiber-array; standard singlemode fiber; vertical coupling technique; wafer scale testing; Fiber gratings; Optical coupling; Optical fiber couplers; Optical fiber polarization; Optical fiber testing; Optical fibers; Optical waveguides; Packaging; Photonics; Silicon on insulator technology; fiber coupling; grating couplers; packaging; silicon photonics; silicon-on-insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Conference_Location
    Rimini
  • Print_ISBN
    978-1-4244-4722-0
  • Electronic_ISBN
    978-0-6152-9868-9
  • Type

    conf

  • Filename
    5272951