• DocumentCode
    503205
  • Title

    Bisected thermodynamic sensor as the power AC/DC transmitter

  • Author

    Reznicek, M. ; Szendiuch, I. ; Reznicek, Zdenek ; Reznicek, Zdenek

  • Author_Institution
    Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
  • fYear
    2009
  • fDate
    15-18 June 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Bisected thermodynamic sensor in temperature shift balance circuit as the power AC/DC transmitter is described. This paper deals with new thick film sensor used for thermodynamic direct power AC/DC transmission in industrial systems. In previous papers the basic principle of thermodynamic sensor was introduced and its construction on alumina ceramic substrate with commercial thick film pastes was demonstrated. Generally this sensor has plenty of application possibilities in various areas of industry. Some final users especially from RF area are asking for galvanic isolated sensors independent to contiguous environment effects. Such applications can be realized by the bisected thermodynamic sensor probe. The basic principle of this solution is bisected thermodynamic sensor with the thermodynamic environment temperature shift between both active sensor sections to influence of ambient temperature compensation. The simulation model of bisected thermodynamic sensor as particular segment elements of thermodynamic system was simulated. Values obtained from simulation are compared and discussed with experimental results. There is a good conformity between calculated and measured values. Results obtained from simulations enables construction of new family of segmented thermodynamic sensor probes in balance circuitry models. These could be integrated into many industrial thermodynamic metering systems designed in standardized design environments. They can be used as technical solution in galvanic isolated power measuring systems in integral industrial designs of any complex thermodynamics systems. Namely power and heat distribution, overpower protection systems, thermal circuit breaking systems, HIRF detection systems, etc.
  • Keywords
    analogue-digital conversion; temperature sensors; thermodynamics; thick film sensors; transmitters; bisected thermodynamic sensor; power AC/DC transmitter; temperature shift balance circuit; thermodynamic sensor; thick film sensor; Circuit simulation; Construction industry; Galvanizing; Integrated circuit measurements; Probes; Temperature sensors; Thermal sensors; Thermodynamics; Thick film sensors; Transmitters; AC/DC transmitter; HIRF; balance circuit; simulation; thermodynamic sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Conference_Location
    Rimini
  • Print_ISBN
    978-1-4244-4722-0
  • Electronic_ISBN
    978-0-6152-9868-9
  • Type

    conf

  • Filename
    5272969