Title :
Thermo-mechanical aspects of reliability for vertically integrated Heterogeneous systems
Author :
Janczyk, Grzegorz ; Bieniek, Tomasz ; Grabiec, Piotr ; Szynka, Jerzy
Author_Institution :
Dept. of Integrated Circuits & Syst., Inst. of Electron Technol., Warsaw, Poland
Abstract :
Vertical device integration is one of the promising device fabrication trends. Heterogeneous device technology research and development faces with new post-fabrication thermo-mechanical problems. Apart from the heat dissipation, temperature dependent mechanical stress spreads across the device affecting its performance. This paper discusses selected stress related device performance and reliability issues.
Keywords :
cooling; integrated circuit manufacture; integrated circuit reliability; device fabrication trends; heat dissipation; heterogeneous device technology research and development; heterogeneous systems; post-fabrication thermo-mechanical problems; reliability thermo-mechanical aspects; temperature dependent mechanical stress; vertical device integration; Corona; Electrons; Fabrication; Integrated circuit technology; Optimized production technology; Reliability engineering; Research and development; Silicon; Stress; Thermomechanical processes; Coventor; Matlab; Multidomain simulations; Reliability; Sensivity; Stress modeling;
Conference_Titel :
Mixed Design of Integrated Circuits & Systems, 2009. MIXDES '09. MIXDES-16th International Conference
Conference_Location :
Lodz
Print_ISBN :
978-1-4244-4798-5
Electronic_ISBN :
978-83-928756-1-1
