Title :
High conductive composites (diamond-silicon carbide) for heat sinking in microwave electronics
Author :
Gordeyev, S.K. ; Korchagina, S.B.
Author_Institution :
FSUE, Central Res. Inst. for Mater., St. Petersburg, Russia
Abstract :
Using the computer simulation it has been shown that diamond-silicon carbide composites have thermal conductivity 1.5...2 times greater than copper. The diamond-SiC composites with thermal conductivity (500...600) W/m K have been developed. Heat sinks of complex shape and large size for microwave techniques have been created.
Keywords :
composite materials; diamond; heat sinks; microwave devices; silicon; thermal conductivity; C-SiC; computer simulation; heat sink; high conductive composites; microwave electronics; thermal conductivity; Application software; Computer industry; Electromagnetic heating; Heat sinks; Silicon carbide; Thermal conductivity;
Conference_Titel :
Microwave & Telecommunication Technology, 2009. CriMiCo 2009. 19th International Crimean Conference
Conference_Location :
Sevastopol
Print_ISBN :
978-1-4244-4796-1
