DocumentCode
503715
Title
Analysis of Fin width and temperature dependence of flicker noise for bulk-FinFET
Author
Ohguro, T. ; Okano, K. ; Izumida, T. ; Inaba, S. ; Momo, N. ; Kokubun, K. ; Momose, H.S. ; Toyoshima, Y.
Author_Institution
Center for Semicond. R&D, Toshiba Corp., Yokohama, Japan
fYear
2009
fDate
28-29 Sept. 2009
Firstpage
61
Lastpage
64
Abstract
In this paper, detailed analysis of Fin width and temperature dependence of flicker noise for bulk-FinFET are described. The FinFET with narrow fin width such as below 30 nm is attractive for scaled CMOS because of double gate structure. Additionally, the flicker noise of FinFET decreases and the temperature dependence of the noise become smaller as the fin width becomes narrower. According to our measurements and simulation analysis, these are because the vertical electrical field from channel to gate electrode has relaxed with narrowing of fin width. The FinFET with narrow fin width is attractive for not only digital but also RF/analog circuits design because of good cut-off characteristics and lower flicker noise.
Keywords
CMOS integrated circuits; MOSFET; flicker noise; semiconductor device noise; CMOS; Fin width; bulk-FinFET; double gate structure; flicker noise; temperature dependence; vertical electrical field; 1f noise; Analog circuits; Analytical models; Annealing; Dry etching; Electrodes; FinFETs; Hydrogen; Radio frequency; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Integrated Circuits Conference, 2009. EuMIC 2009. European
Conference_Location
Rome
Print_ISBN
978-1-4244-4749-7
Type
conf
Filename
5295910
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