An electromagnetic bandgap structure based on a periodic arrangement of via-to-stripline transitions in a multilayer board

In this paper, a contribution to development of electromagnetic bandgap (EBG) structures which can be implemented by means of multilayer board technologies in an electronic system is presented. Introduced structures are formed as a transmission line analogue of the distributed Bragg reflector in which the unit cell comprises a stripline segment and a via structure. As the via structure, both a single signal via and a shield via consisting of signal and ground vias are considered here. In consequence, a compact construction of one-dimensional EBG structures in which unit cells are arranged one under another is realized. Simulation and measurement data verify EBG properties of presented structures. Also, as follows from obtained results, the use of the shield via in the unit cell is an important factor to improve the EBG structure electrical performance.