Title :
Effect of Cu layer thickness on giant magnetoresistance properties of NiCoFe/Cu/NiCoFe sandwich
Author :
Djamal, Mitra ; Ramli ; Yulkifli ; Khairurrijal
Author_Institution :
Theor. High Energy Phys. & Instrum. Res. Group, Inst. Teknol. Bandung, Bandung, Indonesia
Abstract :
The NiCoFe/Cu/NiCoFe sandwiches were grown onto Si (111) substrate by dc-opposed target magnetron sputtering (dc-OTMS) technique. The growth parameters are: temperature 100degC, applied voltage 600 volt, flow rate of Ar gas 100 sccm, and growth pressure 5.2 times 10-1 Torr. The effects of Cu layer thickness on giant magnetoresistance (GMR) property of NiCoFe/Cu/NiCoFe sandwich were studied. We have found that the giant magnetoresistance (GMR) ratio is varied depend on the non-magnetic (Cu) layer thickness. The variation of Cu layer thickness of NiCoFe/Cu/NiCoFe sandwich presents an oscillatory behavior of GMR ratio. This oscillation reflects the exchange coupling oscillations between ferromagnetic and antiferromagnetic states, which are caused by an oscillation in the sign of the interlayer exchange coupling between ferromagnetic layers.
Keywords :
antiferromagnetic materials; cobalt alloys; copper; exchange interactions (electron); ferromagnetic materials; giant magnetoresistance; iron alloys; magnetic multilayers; nickel alloys; semiconductor-metal boundaries; sputter deposition; Ar gas flow rate; NiCoFe-Cu; Si; Si (111) substrate; antiferromagnetic state; applied voltage; dc-opposed target magnetron sputtering; exchange coupling oscillations; ferromagnetic layers; giant magnetoresistance ratio; growth parameters; growth pressure; interlayer exchange coupling; nonmagnetic layer thickness; sandwich materials; Anisotropic magnetoresistance; Antiferromagnetic materials; Electrons; Giant magnetoresistance; Magnetic anisotropy; Magnetic materials; Magnetic properties; Mathematics; Perpendicular magnetic anisotropy; Scattering; Exchange Coupling; Layer Thickness; Magnetoresistance; Opposed Target Magnetron Sputtering;
Conference_Titel :
ICCAS-SICE, 2009
Conference_Location :
Fukuoka
Print_ISBN :
978-4-907764-34-0
Electronic_ISBN :
978-4-907764-33-3