DocumentCode
505465
Title
Temperature as a first-class citizen in chip design
Author
Sapatnekar, Sachin S.
Author_Institution
Univ. of Minnesota, Minneapolis, MN, USA
fYear
2009
fDate
7-9 Oct. 2009
Firstpage
1
Lastpage
1
Abstract
With new technology trends, arising through a confluence of factors such as Moore´s law scaling and 3D integration, the role of thermal design is inexorably shifting from package-centric issues towards on-chip optimizations. This talk overviews the roots of this change, the circuit effects of elevated temperatures, and on-chip optimizations for effective thermal management.
Keywords
chip scale packaging; integrated circuit design; optimisation; reviews; thermal management (packaging); chip design; first-class citizen; on-chip optimization; package-centric issues; review; thermal design; thermal management; Calculus; Chip scale packaging; Conference management; Multicast protocols; Quality of service; Signal processing; Switches; Telecommunications; Temperature; Unicast;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location
Leuven
Print_ISBN
978-1-4244-5881-3
Type
conf
Filename
5340041
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