Title :
Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
Author :
May, D. ; Wunderle, B. ; Schacht, R. ; Michel, B.
Author_Institution :
MicroMaterials Center Berlin, Fraunhofer IZM, Berlin, Germany
Abstract :
Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be presented. It is now possible to have further investigation in material class of polymers, which is very important in the field of system integration. First promising results will be presented.
Keywords :
cracks; polymers; stress analysis; thermoelasticity; IR imaging; compact tension specimen; crack growth rate; crack tip localization; infrared camera system; mechanical stress; periodic loading; polymers; pulse excitation; stress analysis; subcritical crack growth; thermoelastic effect; tip stress concentration; Capacitive sensors; Delamination; Packaging; Polymers; Power system reliability; Pulse circuits; Temperature; Thermal conductivity; Thermal stresses; Thin film circuits;
Conference_Titel :
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location :
Leuven
Print_ISBN :
978-1-4244-5881-3
