DocumentCode :
505480
Title :
Characterization of metal micro-textured thermal interface materials
Author :
Kempers, Roger ; Robinson, Anthony ; Lyons, Alan
Author_Institution :
Alcatel-Lucent, Dublin, Ireland
fYear :
2009
fDate :
7-9 Oct. 2009
Firstpage :
210
Lastpage :
215
Abstract :
To address performance limitations of conventional thermal interface materials (TIMs), a metal micro-textured thermal interface material (MMT-TIM) has been developed that consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. Here, the influence of various geometrical parameters on the mechanical and thermal performance of hollow conical MMT-TIMs is investigated experimentally. The results demonstrate the influence of feature size, shape, array density and foil thickness. The results also serve to highlight the underlying challenge of characterizing the thermal contact resistance of MMT-TIMs. Future efforts for this project are discussed including the validation of a numerical thermal-mechanical model and development of a relationship between electrical and thermal contact resistance for MMT-TIMs that would allow estimation of the thermal contact resistance using a straightforward electrical measurement.
Keywords :
foils; interface structure; metallic thin films; plastic deformation; texture; thermal conductivity; thermal resistance; array density; hollow conical MMT-TIM; metal microtextured thermal interface materials; plastic deformation; thermal conduction; thermal contact resistance; thin metal foil; Conducting materials; Contact resistance; Electric variables measurement; Electrical resistance measurement; Inorganic materials; Numerical models; Shape; Surface resistance; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location :
Leuven
Print_ISBN :
978-1-4244-5881-3
Type :
conf
Filename :
5340056
Link To Document :
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