• DocumentCode
    505489
  • Title

    Electro-thermal modeling of different LEP-thickness white OLEDs

  • Author

    Kollár, Ernõ ; Hantos, Gusztáv

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2009
  • fDate
    7-9 Oct. 2009
  • Firstpage
    121
  • Lastpage
    123
  • Abstract
    In our project the final purpose is to develop a cost-effective roll-to-roll technology of fabricating large-surface, high-output OLED (organic light emitting diode) devices for intelligent lighting applications. The electrical and optical characteristics of multi-layered OLEDs depend on the thickness of the layers. To reach the highest efficiency in an application is needed to optimize the each layers. In this paper we have measured the I-V characteristics of the different LEP (light emitting polymer) thickness white OLEDs. We have examined in 50degC wide temperature range. We have created an electro-thermal model, which describe the temperature and LEP thickness dependence of the forward bias. The results work as the feedback for the fabrication process and the OLED planning to our project partner.
  • Keywords
    conducting polymers; multilayers; organic light emitting diodes; organic semiconductors; polymer films; semiconductor device models; semiconductor thin films; I-V characteristics; LEP thickness; electrothermal modeling; intelligent lighting applications; large-surface high-output OLED; light emitting polymer; multilayered OLED; organic light emitting diode; temperature 50 degC; white OLED; Fabrication; LED lamps; Optical feedback; Optical polymers; Organic light emitting diodes; Process planning; Stimulated emission; Temperature dependence; Temperature distribution; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
  • Conference_Location
    Leuven
  • Print_ISBN
    978-1-4244-5881-3
  • Type

    conf

  • Filename
    5340066