DocumentCode :
505490
Title :
Design modeling and simulation of electrothermally actuated microgyroscope fabricated using the MetalMUMPs
Author :
Shakoor, Rana I. ; Bazaz, Shafaat A. ; Hasan, M.M.
Author_Institution :
Pakistan Inst. of Eng. & Appl. Sci., Islamabad, Pakistan
fYear :
2009
fDate :
7-9 Oct. 2009
Firstpage :
40
Lastpage :
44
Abstract :
This paper presents a thermally actuated resonant microgyroscope fabricated using commercially available standard MEMS process MetalMUMPs. Chevron-shaped thermal actuator is being used to drive the proof mass whereas sensing mechanism of the proposed device is based on the parallel plate sensing electrodes. The proposed model consists of three proof masses coupled with each other to be driven in through a frame. To achieve larger bandwidth and increased sensitivity, the proposed model of microgyroscope is operated with a slight mismatch in the resonant frequency. The resonant frequencies of microgyroscope are predicted to be 5.37 kHz for drive mode and 5.02 kHz for sensing mode. Finite element simulations are carried out to predict the performance of the proposed device using the thermo-physical properties of electroplated nickel. A brief theoretical description, dynamics and mechanical design considerations of the proposed gyroscopes model are also discussed. Prototype fabrication using MetalMUMPs has also been investigated in this study. Static simulation predicted a high drive displacement of 4.88 mum at 0.1Vdc whereas dynamic transient simulations predicted a displacement of 0.28 mum when a sinusoidal voltage of 0.1 V is applied. The proposed device has a size of 1.8 times 2.0 mm2 with an estimated power consumption of 0.26 Watts.
Keywords :
electroplated coatings; finite element analysis; gyroscopes; metallic thin films; microactuators; microfabrication; microsensors; nickel; Chevron-shaped thermal actuator; MetalMUMP; Ni; drive displacement; drive mode resonant frequency; dynamic transient simulations; electroplated nickel; electrothermally actuated microgyroscope; finite element simulations; gyroscope dynamics; metalmultiuser MEMS processes; microgyroscope design modeling; parallel plate sensing electrodes; proof mass; resonant frequency mismatch; resonant microgyroscope; sensing mechanism; static simulation; thermophysical properties; voltage 0.1 V; Actuators; Bandwidth; Electrodes; Electrothermal effects; Finite element methods; Micromechanical devices; Nickel; Predictive models; Resonance; Resonant frequency; Chevron shaped actuator; Finite element method; MEMS; Micromachined Gyroscope; thermal V shaped actuator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location :
Leuven
Print_ISBN :
978-1-4244-5881-3
Type :
conf
Filename :
5340067
Link To Document :
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