DocumentCode
505493
Title
Heat transfer enhancement due to pulsating flow in a microchannel heat sink
Author
Persoons, T. ; Saenen, T. ; Donose, R. ; Baelmans, M.
Author_Institution
Dept. of Mech. Eng. (TME), Katholieke Univ. Leuven, Leuven, Belgium
fYear
2009
fDate
7-9 Oct. 2009
Firstpage
163
Lastpage
167
Abstract
Heat sinks with liquid forced convection in microchannels are targeted for cooling microelectronic devices with a high dissipated power density. Given the inherent stability problems associated with two-phase microchannel heat transfer, this paper investigates experimentally the potential for enhancing single-phase convection cooling rates by applying pulsating flow. To this end, a pulsator device is developed which allows independent continuous control of pulsation amplitude and frequency. For a single microchannel geometry and a range of parameters (steady and pulsating Reynolds number, Womersley number), experimental results are presented for the overall heat transfer enhancement compared to the steady flow case. Enhancement factors up to 40% are observed for the investigated parameter range (50 Lt Re Lt 400, 35 Lt Rep Lt 225,2 Lt Wo Lt 17).
Keywords
forced convection; heat sinks; microchannel flow; pulsatile flow; Womersley number; heat transfer enhancement; liquid forced convection; microchannel heat sink; microelectronic device cooling; pulsating Reynolds number; pulsating flow; pulsator device; single-phase convection cooling rate; Aluminum; Cooling; Frequency; Heat engines; Heat sinks; Heat transfer; Heating; Microchannel; Microelectronics; Stability; Pulsating flow; boundary layer redevelopment; single-phase heat transfer enhancement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location
Leuven
Print_ISBN
978-1-4244-5881-3
Type
conf
Filename
5340070
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