Title :
Message from the outgoing Editor-in-Chief
Author_Institution :
Oregon State University, Corvallis, OR, USA
Abstract :
The outgoing Editor-in-Cheif´s (EiC´s) three-year term serving the IEEE JOURNAL OF SOLID-STATE CIRCUITS has now come to a close. He states that it has been a pleasure to hold this post and certainly a very rewarding experience. While upholding our own finest standard demanded by the Solid-State Circuits community, our Journal continues to be the most downloaded journal in IEEE Xplore as well as being the most referred journal in US Patents. All this was made possible only because of the continued support of many individuals who make the Journal what it is.
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2013.2272115