Abstract :
□ Large and Compelling Opportunity S Additional Modes and Bands (LIE, wiMax, …) ✓ Significant BOM and Footprint Reduction (antennas / switches / filters / amplifiers) ✓ Substantial Platform RF Optimization Cycle Reduction (Weeks reduced to hours) ✓ Performance Improvements (Transmit Efficiency, Receive Sensitivity) □ Differentiated and Enabling Product Technology ✓ CMOS/MEMS integration, Standard Fabless Flows (CMOS cost, scale, yield) ✓ High RF Performance (Ratio, Q, Isolation, Linearity) ✓ CMOS blocks Developed (≤ 100uA w/ 3V supply, SPI interface, ESD protection) ✓ Proven wafer-level sealing (Low Cost, Easy Assembly, Reproducibility, Reliability) ✓ Durable and Reliable (Temperature Stability, Cycling, Environmental robustness) ✓ Applicable to wide range of applications (roadmap leading to full front-end) □ Strong Initial Market Traction ✓ Multiple Tier 1 Handset OEM Development Engagements ✓ Tier 1 Network Operator Investment and Development Engagement ✓ Tier 1 Front-End Module Development Engagement □ Transitioning from Technology Development to Products and Revenue ✓ Initial products developed and tested ✓ 100´s delivered for handset integration, testing and software development ✓ Integrated MEMS-CMOS process frozen at Jazz Semiconductor ✓ Application/Product Roadmap using baseline technology — Antennas, PAs, Duplexers … ✓ Tuner product in qualification!
