Title :
Grooming IC Designer through apprenticeship programme
Author :
Intan, N. ; Amir, M. ; Sakrani, S. ; Afham, M.
Author_Institution :
Res. & Postgrad. Studies, Univ. Kuala Lumpur, Kuala Lumpur, Malaysia
Abstract :
The rapid growth in the microelectronics industry and the challenges increasing such as globalization, technological changes and specialization has brought about a demand for skill manpower. Therefore, the apprenticeship program in IC design which provided a comprehensive training is really significant to the industry need. The apprenticeship program was conducted at ICmic-UniKL Academy which focuses on microelectronics competency development for Malaysian in producing commercial integrated circuit (IC) products. Through this apprenticeship, apprentice was exposed to the hands-on job with entrepreneurial skills who can directly participate in microelectronics design and related industries thus closing the gap with industry requirement. A supervisory circuit with watchdog timer feature was highlighted to show one of the project carried out by the apprentice. At the end of this apprenticeship, the apprentice will able to master the skills and has necessary knowledge to become a highly competent and entrepreneurial design engineer.
Keywords :
globalisation; integrated circuit design; integrated circuit manufacture; reference circuits; training; ICmic-UniKL Academy; Malaysian; apprenticeship programme; comprehensive training; entrepreneurial skills; globalization; integrated circuit designer; integrated circuit products; microelectronics industry; supervisory circuit; Application specific integrated circuits; Design engineering; Economic forecasting; Electronics industry; Globalization; Industrial electronics; Industrial training; Job design; Microelectronics; Software tools; Apprentice; IC design; supervisory circuit; watchdog timer;
Conference_Titel :
Industrial Electronics & Applications, 2009. ISIEA 2009. IEEE Symposium on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-4681-0
Electronic_ISBN :
978-1-4244-4683-4
DOI :
10.1109/ISIEA.2009.5356408