Title :
Smart packaging: printed intelligence in high volume packaging
Author :
Kuusisto, Jani-Mikael
Author_Institution :
IET Seminar on Polymer Electronics, UK
Abstract :
• Smart packaging shows significant market growth potential. • Organic electronics and printed intelligence show technological developments which can significantly expand the market for smart packaging. • Increasing focus required on smart packaging applications.
Conference_Titel :
Polymer Electronics: Towards the Future, 2009 IET Seminar on
Conference_Location :
London, UK
Print_ISBN :
978-1-84919-122-7
