DocumentCode :
506663
Title :
Research on modeling technology for dynamic modular design
Author :
Xiao, Yanqiu ; Luo, Guofu ; Ma, Jun ; Li, Hao
Author_Institution :
Sch. of Mech. & Electron. Eng., Zhengzhou Univ. of Light Ind., Zhengzhou, China
Volume :
3
fYear :
2009
fDate :
20-22 Nov. 2009
Firstpage :
681
Lastpage :
685
Abstract :
Modular design is a dynamic process and obtains rational architecture of product family continuously. It needs modeling technology to prepare skeleton for evolution of product system, and adapt to the dynamic characteristic. In this paper, a joint modeling technique is proposed to prepare for evolution of product system, which considers design process as one part of the product system. According to close-loop process of modular design, modeling techniques are analysed and a joint modeling approach is advanced. By comparing interface propagation with network, correlative information is organized in the form of network, and it is collected into a tri-view model. Then collaborative model is given by modular layouts and model of product family is established. In this way, a two-way channel for application and optimization of modular scheme is taken shape. Finally, a case is presented to illustrate the application of this approach, which proved the effectiveness of this approach.
Keywords :
computer integrated manufacturing; product design; close-loop process; design process; dynamic modular design; interface propagation; joint modeling; modeling technology; modular layout; product family; product system evolution; rational architecture; tri-view model; two-way channel; Collaboration; Design engineering; Design methodology; Design optimization; Electronics industry; Industrial electronics; Joints; Process design; Product design; Skeleton; constraint network; correlative information; dynamic modular design; joint modeling; product system;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Computing and Intelligent Systems, 2009. ICIS 2009. IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-4754-1
Electronic_ISBN :
978-1-4244-4738-1
Type :
conf
DOI :
10.1109/ICICISYS.2009.5358093
Filename :
5358093
Link To Document :
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