DocumentCode :
50681
Title :
L1–L2 Interconnect Design Methodology and Arbitration in 3-D IC Multicore Compute Clusters
Author :
Jolondz, Alexei ; Weiss, Steven ; Golander, A.
Author_Institution :
Sch. of Electr. Eng., Tel-Aviv Univ., Tel-Aviv, Israel
Volume :
22
Issue :
10
fYear :
2014
fDate :
Oct. 2014
Firstpage :
2206
Lastpage :
2210
Abstract :
We introduce a novel 3-D implementation of the interconnect between cores and shared L2 cache banks for multicore clusters. The 3-D structure extends cluster sizes that can be supported with tolerable wire delays. As a result of the shorter connections achieved by splitting existing 2-D design into four layers, performance is improved and area and power are reduced. The splitting enables implementation of a better arbitration scheme, which leads to additional performance improvement.
Keywords :
cache storage; integrated circuit interconnections; microprocessor chips; multiprocessing systems; three-dimensional integrated circuits; 3D IC multicore compute clusters; L1-L2 interconnect design methodology; L2 cache banks; wire delays; Benchmark testing; Delays; Integrated circuits; Latches; Multicore processing; Ports (Computers); Wires; 3-D integrated circuit (IC); interconnect; multicore; multilevel cache; multilevel cache.;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2013.2284259
Filename :
6632925
Link To Document :
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