Title :
Electric Field Distribution Around Drain-Side Gate Edge in AlGaN/GaN HEMTs: Analytical Approach
Author :
Jia Si ; Jin Wei ; Wanjun Chen ; Bo Zhang
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
An analytical model is proposed in this paper for the surface electric field around the drain-side gate edge in the AlGaN/GaN HEMT to which the gate leakage, current collapse, and so on are highly related. Conformal mapping is implemented to mirror the device structure into a simplified geometry and the solution to the Laplace equation is thus achieved. Obtained from the proposed model, the surface electric field in the AlGaN/GaN HEMT shows a high peak around the drain-side gate edge, which is the cause for many reliability issues in HEMTs. The proposed model is then used to study the main factors that may impact the field distribution, such as drain voltage, thickness of barrier, and so on. Numerical simulations are carried out and compared with the analytical model. The high agreement between the results verifies the proposed model.
Keywords :
III-V semiconductors; Laplace equations; aluminium compounds; conformal mapping; electric fields; gallium compounds; high electron mobility transistors; semiconductor device models; semiconductor device reliability; wide band gap semiconductors; AlGaN-GaN; HEMT reliability; Laplace equation; analytical approach; conformal mapping; current collapse; device structure; drain-side gate edge; electric field distribution; gate leakage; numerical simulations; surface electric field; Aluminum gallium nitride; Boundary conditions; Gallium nitride; HEMTs; Logic gates; MODFETs; Numerical models; Analytical model; HEMTs; gate-edge electric field;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2013.2272055