• DocumentCode
    50721
  • Title

    Electric Field Distribution Around Drain-Side Gate Edge in AlGaN/GaN HEMTs: Analytical Approach

  • Author

    Jia Si ; Jin Wei ; Wanjun Chen ; Bo Zhang

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • Volume
    60
  • Issue
    10
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    3223
  • Lastpage
    3229
  • Abstract
    An analytical model is proposed in this paper for the surface electric field around the drain-side gate edge in the AlGaN/GaN HEMT to which the gate leakage, current collapse, and so on are highly related. Conformal mapping is implemented to mirror the device structure into a simplified geometry and the solution to the Laplace equation is thus achieved. Obtained from the proposed model, the surface electric field in the AlGaN/GaN HEMT shows a high peak around the drain-side gate edge, which is the cause for many reliability issues in HEMTs. The proposed model is then used to study the main factors that may impact the field distribution, such as drain voltage, thickness of barrier, and so on. Numerical simulations are carried out and compared with the analytical model. The high agreement between the results verifies the proposed model.
  • Keywords
    III-V semiconductors; Laplace equations; aluminium compounds; conformal mapping; electric fields; gallium compounds; high electron mobility transistors; semiconductor device models; semiconductor device reliability; wide band gap semiconductors; AlGaN-GaN; HEMT reliability; Laplace equation; analytical approach; conformal mapping; current collapse; device structure; drain-side gate edge; electric field distribution; gate leakage; numerical simulations; surface electric field; Aluminum gallium nitride; Boundary conditions; Gallium nitride; HEMTs; Logic gates; MODFETs; Numerical models; Analytical model; HEMTs; gate-edge electric field;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2272055
  • Filename
    6564424