Title :
From 2D to 3D NoCs: A case study on worst-case communication performance
Author :
Qian, Yue ; Lu, Zhonghai ; Dou, Wenhua
Author_Institution :
Sch. of Comput. Sci., Nat. Univ. of Defense Technol., Changsha, China
Abstract :
Advanced integration technologies enable the construction of Network-on-Chip (NoC) from two dimensions to three dimensions. Studies have shown that 3D NoCs can improve average communication performance because of the possibility of using the additional dimension to shorten communication distance. In this paper, we present a detailed case study on worst-case communication performance in regular k-ary-2-mesh networks. Through both analysis and simulation, we show that, while 3D networks achieve better average performance, this may not be the case for worst-case performance mainly due to constraints on vertical channels. Our analysis is based on network calculus, which allows to calculate theoretical delay bounds for constrained flows traversing network elements.
Keywords :
integrated circuit modelling; network-on-chip; 2D NoC; 3D NoC; communication distance; network calculus; network elements; network-on-chip; vertical channels; worst-case communication; Calculus; Computer science; Delay; Integrated circuit interconnections; Integrated circuit technology; Network-on-a-chip; Performance analysis; Permission; Scalability; Three-dimensional integrated circuits; 2D/3D Network-on-Chip; Delay Bound; Network Calculus; Performance Analysis; Quality-of-Service;
Conference_Titel :
Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-60558-800-1
Electronic_ISBN :
1092-3152
