DocumentCode
507406
Title
From 2D to 3D NoCs: A case study on worst-case communication performance
Author
Qian, Yue ; Lu, Zhonghai ; Dou, Wenhua
Author_Institution
Sch. of Comput. Sci., Nat. Univ. of Defense Technol., Changsha, China
fYear
2009
fDate
2-5 Nov. 2009
Firstpage
555
Lastpage
562
Abstract
Advanced integration technologies enable the construction of Network-on-Chip (NoC) from two dimensions to three dimensions. Studies have shown that 3D NoCs can improve average communication performance because of the possibility of using the additional dimension to shorten communication distance. In this paper, we present a detailed case study on worst-case communication performance in regular k-ary-2-mesh networks. Through both analysis and simulation, we show that, while 3D networks achieve better average performance, this may not be the case for worst-case performance mainly due to constraints on vertical channels. Our analysis is based on network calculus, which allows to calculate theoretical delay bounds for constrained flows traversing network elements.
Keywords
integrated circuit modelling; network-on-chip; 2D NoC; 3D NoC; communication distance; network calculus; network elements; network-on-chip; vertical channels; worst-case communication; Calculus; Computer science; Delay; Integrated circuit interconnections; Integrated circuit technology; Network-on-a-chip; Performance analysis; Permission; Scalability; Three-dimensional integrated circuits; 2D/3D Network-on-Chip; Delay Bound; Network Calculus; Performance Analysis; Quality-of-Service;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-60558-800-1
Electronic_ISBN
1092-3152
Type
conf
Filename
5361240
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