• DocumentCode
    507438
  • Title

    A hybrid local-global approach for multi-core thermal management

  • Author

    Jayaseelan, Ramkumar ; Mitra, Tulika

  • Author_Institution
    Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2009
  • fDate
    2-5 Nov. 2009
  • Firstpage
    314
  • Lastpage
    320
  • Abstract
    Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have necessitated system level thermal management solutions for multi-core systems. Dynamic thermal management (DTM) techniques monitor on-chip temperature continuously and typically employs dynamic voltage and frequency scaling (DVFS) to lower the temperature when it exceeds a pre-defined threshold. State-of-the-art DTM solutions for multi-core systems include distributed DVFS (where each core can scale the voltage/ frequency individually) and global DVFS (where all cores scale voltage/frequency simultaneously). Distributed DVFS generally offers higher performance than global DVFS, but it is hard to implement and has major scalability issues. We propose a hybrid local-global thermal management approach for multi-core systems that offers better performance than distributed DVFS, while maintaining the simplicity of global DVFS. We employ global DVFS across all the cores but locally tune the performance of each core individually through architectural adaptations. We exploit easily reconfigurable micro-architecture parameters such as instruction window size, issue width, and fetch throttling in per-core thermal management. Our hybrid solution is easy to implement and highly effective towards temperature management. The key challenge is appropriate choice of configurations at runtime to provide optimal performance under thermal constraints. We formulate it as a configuration search problem and design an efficient software-based solution that selects the appropriate configuration. Our hybrid method, though simpler to implement, achieves 5% better throughput compared to distributed DVFS.
  • Keywords
    multiprocessing systems; reliability; software architecture; thermal management (packaging); dynamic thermal management; dynamic voltage; fetch throttling; frequency scaling; hybrid local-global approach; instruction window size; mainstream high performance computer systems; multi-core processors; multi-core thermal management; on-chip temperature; packaging costs; power density; reconfigurable micro-architecture parameters; system level thermal management solutions; Costs; Dynamic voltage scaling; Energy management; Frequency; High performance computing; Multicore processing; Packaging; Power system management; Temperature; Thermal management; Architecture Adaptation; Dynamic Thermal Management (DTM); Global DVFS; Multi-Core;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-60558-800-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • Filename
    5361273