• DocumentCode
    50744
  • Title

    IEEE Microwave and Wireless Components Letters information for authors

  • Volume
    23
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Abstract
    Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2013.2245274
  • Filename
    6459020
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=50744