• DocumentCode
    507479
  • Title

    How to consider shorts and guarantee yield rate improvement for redundant wire insertion

  • Author

    Chang, Fong-Yuan ; Tsay, Ren-Song ; Mak, Wai-Kei

  • Author_Institution
    Dept. of Comput. Sci., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    2-5 Nov. 2009
  • Firstpage
    33
  • Lastpage
    38
  • Abstract
    This paper accurately considers wire short defects and proposes an algorithm to guarantee IC chip yield rate improvement for redundant wire insertion. Without considering yield rate degradation caused by shorts, traditional methods may even lead to yield rate loss. However, shorts are more complicated to analyze than opens. Moreover, since any two points of a routed net can be connected by a redundant wire, the number of possible insertion patterns for a chip is un-tractable. To maximize yield rate improvement and to make the problem tractable, we identify a key insight, tolerance-ratio, as an effective guide for choosing insertion patterns and insertion order. Finally, to guarantee yield rate improvement, only positive gain redundant wires are committed. Experimental results show that, compared with unprocessed cases, all yield rate improvements in the proposed algorithm are positive, and the defect rates are reduced by up to 65% and by 24% on average. On the other hand, without considering shorts, the defect rate can increase as much as 7%.
  • Keywords
    integrated circuit design; integrated circuit yield; IC chip yield rate improvement; redundant wire insertion; wire short defects; yield rate degradation; Circuit faults; Degradation; Electromigration; Integrated circuit yield; Permission; Routing; Semiconductor device manufacture; Shape; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-60558-800-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • Filename
    5361317