Title : 
Scalable arbitration of partitioned bus interconnection networks in 3D-IC systems
         
        
            Author : 
Ireland, Kelli ; Jezak, Joseph ; Levitan, Steven ; Chiarulli, Donald
         
        
            Author_Institution : 
Comput. Eng. Dept., Univ. of Pittsburgh, Pittsburgh, PA, USA
         
        
        
        
        
        
            Abstract : 
In this paper, we describe a scalable interconnection network architecture intended for very large multicore processors implemented on stacked chip 3D integrated circuits (3D-IC). These networks provide fully interconnected, low latency, single hop performance with wiring complexity that scales linearly with the size of the network. The enabling technology for these networks is a novel, fully distributed arbitration and control algorithm that operates solely at the edges of the network without the need for any routers within the network core. This paper is focused on a description of that algorithm. We present simulation results for average, worst-case, and per-node latencies showing that our arbitration algorithm performs efficiently, scales for a wide range of partition sizes, and effectively manages highly non-uniform traffic patterns.
         
        
            Keywords : 
integrated circuit interconnections; integrated circuit layout; microprocessor chips; three-dimensional integrated circuits; 3D integrated circuit; distributed arbitration and control algorithm; partitioned bus interconnection network; scalable interconnection network architecture; very large multicore processors; Delay; Distributed control; Integrated circuit interconnections; Integrated circuit technology; Multicore processing; Multiprocessor interconnection networks; Partitioning algorithms; Telecommunication traffic; Three-dimensional integrated circuits; Wiring; Interconnection Network; Multicore; Network on Chip;
         
        
        
        
            Conference_Titel : 
Network on Chip Architectures, 2009. NoCArc 2009. 2nd International Workshop on
         
        
            Conference_Location : 
New York, NY
         
        
            Print_ISBN : 
978-1-60558-774-5