DocumentCode :
510007
Title :
Yield enhancement by robust application-specific mapping on network-on-chips
Author :
Choudhury, A. Dutta ; Palermo, G. ; Silvano, C. ; Zaccaria, V.
Author_Institution :
ALaRI, Univ. of Lugano, Lugano, Switzerland
fYear :
2009
fDate :
12-12 Dec. 2009
Firstpage :
37
Lastpage :
42
Abstract :
The current technological defect densities and production yields are a motivating factor supporting the introduction of design-for-manufacturability techniques during the high-level design of complex, embedded systems based on network-on-chips (NoCs). In this context, we tackle the problem of mapping the IPs of a multi-processing system to the NoC nodes, by taking into account the effective robustness of the system with respect to permanent faults in the interconnection network due to manufacturing defects. In particular, we introduce an application specific methodology for identifying optimal NoCs mappings which minimize the variance of the system power and latency and maximizes the probability that the actual system will work when deployed, even in presence of faulty NoC links. We provide experimental results by comparing the proposed methodology with conventional mapping approaches, by highlighting benefits and drawbacks of both techniques.
Keywords :
application specific integrated circuits; design for manufacture; embedded systems; integrated circuit metallisation; integrated circuit yield; network-on-chip; NoC links; application-specific mapping; complex, embedded systems; design-for-manufacturability techniques; high-level design; interconnection network; multi-processing system; network-on-chips; permanent faults; production yields; technological defect densities; yield enhancement; Circuit faults; Embedded system; Hardware; Manufacturing; Multiprocessor interconnection networks; Network-on-a-chip; Robustness; Routing; System recovery; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Network on Chip Architectures, 2009. NoCArc 2009. 2nd International Workshop on
Conference_Location :
New York, NY
Print_ISBN :
978-1-60558-774-5
Type :
conf
Filename :
5375717
Link To Document :
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