Title :
Low temperature wiring with Ag inks: New β-ketocarboxylate Ag inks for 100 °C curing
Author :
Kawazome, Mitsuru ; Kim, Keun-Soo ; Suganuma, Katsuaki
Author_Institution :
Central Res. Center, Toppan Forms Co., Ltd., Hachioji, Japan
Abstract :
This paper summarizes a Ag carboxylate ink technology for patterning circuits on heat-sensitive substrates. Low temperature processes for making circuits is becoming one of the key issues for printed electronics primarily because of the potentials of heat-sensitive substrates such as PET films and papers. The authors have developed Ã-ketocarboxylate Ag inks that can be cured around 100°C. The electrical specifications and microstructural observations of the new ink printed on commercial papers are demonstrated.
Keywords :
curing; ink; nanopatterning; organic compounds; polymer films; printed circuits; substrates; wiring; Ag carboxylate ink technology; PET films; curing; heat-sensitive substrates; low temperature wiring; microstructure; papers; printed electronics; temperature 100 C; Ã\x9f-ketocarboxylate Ag inks; Circuits; Costs; Curing; Ink; Inorganic materials; Nanoparticles; Positron emission tomography; Temperature; Water; Wiring; β-ketocarboxylate Ag ink; ink-jet printing; printed electronics; wiring;
Conference_Titel :
Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on
Conference_Location :
Genoa
Print_ISBN :
978-1-4244-4832-6
Electronic_ISBN :
1944-9399