DocumentCode
511379
Title
Carbon nanotubes as cooling fins in microelectronic systems
Author
Fu, Yifeng ; Wang, Teng ; Liu, Johan ; Wang, Xiaojing ; Zhang, Yan
Author_Institution
Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Goteborg, Sweden
fYear
2009
fDate
26-30 July 2009
Firstpage
44
Lastpage
49
Abstract
Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.
Keywords
carbon nanotubes; cooling; heat sinks; integrated circuit packaging; microchannel flow; nanotube devices; C; carbon nanotubes; cooling fins; electronic components; mechanical properties; microchannel heat sink; microelectronic systems; microfins; thermal properties; Carbon nanotubes; Electronic components; Electronics cooling; Heat engines; Heat sinks; Inorganic materials; Laboratories; Microelectronics; Thermal management; Thermal management of electronics; Carbon Nanotube (CNT); cooling; electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on
Conference_Location
Genoa
ISSN
1944-9399
Print_ISBN
978-1-4244-4832-6
Electronic_ISBN
1944-9399
Type
conf
Filename
5394570
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