Title :
Carbon nanotubes as cooling fins in microelectronic systems
Author :
Fu, Yifeng ; Wang, Teng ; Liu, Johan ; Wang, Xiaojing ; Zhang, Yan
Author_Institution :
Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Goteborg, Sweden
Abstract :
Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.
Keywords :
carbon nanotubes; cooling; heat sinks; integrated circuit packaging; microchannel flow; nanotube devices; C; carbon nanotubes; cooling fins; electronic components; mechanical properties; microchannel heat sink; microelectronic systems; microfins; thermal properties; Carbon nanotubes; Electronic components; Electronics cooling; Heat engines; Heat sinks; Inorganic materials; Laboratories; Microelectronics; Thermal management; Thermal management of electronics; Carbon Nanotube (CNT); cooling; electronics;
Conference_Titel :
Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on
Conference_Location :
Genoa
Print_ISBN :
978-1-4244-4832-6
Electronic_ISBN :
1944-9399
