DocumentCode
511730
Title
Obstacle-avoiding electromigration aware wire planning for analog circuits
Author
Lin, Cheng-Chiang ; Huang, Hsin-Hsiung ; Chien, His-An ; Hsieh, Tsai-Ming
Author_Institution
Dept. of Inf. & Comput. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
fYear
2009
fDate
14-16 Dec. 2009
Firstpage
651
Lastpage
654
Abstract
In this paper, we propose an integer linear programming (ILP for short) based algorithm to solve the electromigration aware wire planning which supports the sufficient wire width for each wire according the current values of all sources and targets in analog circuit. The objective is to minimize the total wiring area in the presence of obstacles. First, we perform the reservation space technique for all obstacles to void the interference between the wires and obstacles. Second, we calculate the wire lengths of all source-target pairs with consideration the obstacles. Third, the topology which contains the sufficient widths for all wires is determined by the proposed ILP formulations. Finally, the wire planning results are obtained by transforming each wire of the topology into the horizontal and vertical segments. For the problem of wire planning without obstacles, a legal current assignment will be obtained with minimal wiring area. Experimental results show that the ILP-based approach is significantly improved 13.24% of wiring area on average as compared to the results of the greedy method.
Keywords
analogue integrated circuits; electromigration; integer programming; integrated circuit design; linear programming; analog circuit; integer linear programming; interference; legal current assignment; obstacle-avoiding electromigration aware wire planning; source-target pairs; topology; Analog circuits; Analog computers; Analog integrated circuits; Current density; Electromigration; Interference; Routing; Technology planning; Wire; Wiring; electromigration; obstacleavoiding; reservation space; wire planning;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
Conference_Location
Singapore
Print_ISBN
978-9-8108-2468-6
Type
conf
Filename
5403686
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