DocumentCode :
511731
Title :
Computation of charge collection probability for any collecting junction shape
Author :
Kurniawan, Oka ; Ong, Vincent K.S. ; Tan, Chee Chin ; Li, Erping
Author_Institution :
A*STAR, Inst. of High Performance Comput., Singapore, Singapore
fYear :
2009
fDate :
14-16 Dec. 2009
Firstpage :
639
Lastpage :
642
Abstract :
Electron-beam-induced current (EBIC) of the scanning electron microscope (SEM) has been widely used for semiconductor devices and materials characterizations. The charge collection probability within a collecting junction plays an important role in determining the EBIC current. The conventional approach starts by solving the continuity equation to obtain the charge carrier density and then the analytical expression for the charge collection probability. Knowing the analytical expression of the charge collection probability enhances the study and development of the measurement technique. However, the conventional method usually requires lot of mathematical effort and the derived analytical expression is valid only for one particular junction shape. This paper presents a simple and straight forward computational method for the charge collection probability distribution within the charge collecting junction well by utilizing the reciprocity theorem and finite difference method with the junction shape serves as the boundary conditions. It not only simplifies the computation but also applicable to any junction shape as long as the drift-diffusion model remains valid. This method was verified using a U-shaped junction well.
Keywords :
EBIC; carrier density; finite difference methods; p-n junctions; scanning electron microscopy; semiconductor device measurement; statistical distributions; EBIC current; U-shaped junction; charge carrier density; charge collection probability distribution; continuity equation; drift-diffusion model; electron-beam-induced current; finite difference method; junction shape; measurement technique; reciprocity theorem; scanning electron microscope; semiconductor devices; Charge carrier density; Distributed computing; Equations; Measurement techniques; Numerical analysis; Probability distribution; Scanning electron microscopy; Semiconductor devices; Semiconductor materials; Shape; Charge carrier processes; electron beam applications; finite difference methods; semiconductor materials measurements; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-9-8108-2468-6
Type :
conf
Filename :
5403687
Link To Document :
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