Title :
A 1.8 V to 3.3 V level-converting flip-flop design for multiple power supply systems
Author :
Chua-Chin Wang ; Liu, Jen-Wei ; Kuo, Ron-Chi ; Li, Katherine Shu-Min ; Wang, Chua-Chin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
The voltage islands scheme using multiple supply voltages (MSV) has been widely used in system-on-chip (SoC) designs to reduce the unnecessary power dissipation in non-critical function blocks. In these SoC designs, the circuit blocks with the same voltage level are clustered into a single voltage island to reduce the cost of voltage supply network and the power consumption. However, a voltage level converter is required to stitch different voltage islands when the normal scan mode is activated. Besides carrying out the scan testing function, the level converter should be able to overcome the gate-oxide overstress problem given more than two supply voltages and backward compatibility. In this study, a 1.8 V to 3.3 V level converting flip-flop (LCFF) implemented using 0.18 ¿m CMOS technology is proposed. By utilizing the voltage keeper technique, the power consumption and the power delay product (PDP) can be successfully reduced without any leakage current path.
Keywords :
CMOS logic circuits; convertors; flip-flops; logic design; system-on-chip; CMOS technology; SoC designs; gate-oxide overstress problem; leakage current path; level-converting flip-flop design; multiple power supply systems; noncritical function blocks; normal scan mode; power consumption; power delay product; scan testing function; size 0.18 mum; system-on-chip designs; unnecessary power dissipation; voltage 1.8 V to 3.3 V; voltage islands scheme; voltage keeper technique; voltage level converter; voltage supply network; CMOS technology; Circuit testing; Costs; Delay; Energy consumption; Flip-flops; Power dissipation; Power supplies; System-on-a-chip; Voltage; Dual-supply voltage; flip-flop; level conversion;
Conference_Titel :
Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-9-8108-2468-6