DocumentCode :
511858
Title :
Subcircuit approach to inventive compact modeling for CMOS variability and reliability
Author :
Zhou, X. ; Zhu, G.J. ; Lin, S.H. ; Chen, Z.H. ; Srikanth, M.K. ; Yan, Y.F. ; Selvakumar, R. ; Chandra, W. ; Zhang, J.B. ; Wei, C.Q. ; Wang, Z.H. ; Bathla, P.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2009
fDate :
14-16 Dec. 2009
Firstpage :
133
Lastpage :
136
Abstract :
This paper presents ideas for the development of multi-level compact model (CM) approach to variability and reliability for future generation MOS devices/circuits. Important device/circuit/gate figures-of-merit (FOMs) are formulated in multiple abstraction domains with dual-representation as statistical and probabilistic CMs, and reliability CMs are built into the core CM and propagated to circuit/gate levels. Rather than following the traditional ¿predictive¿-CM paradigm to `chase´ a given technology, the innovative ideas promote the notion of ¿inventive¿-CM, in which ¿stat/prob/rel-CMs¿ are developed at the multiple device/circuit levels for variability/reliability assessment together with the evolving technology and design, as it is believed that ¿the best way to predict future is to invent it¿.
Keywords :
CMOS integrated circuits; integrated circuit reliability; CMOS variability; gate figures-of-merit; generation MOS devices-circuit reliability; inventive compact modeling; multilevel compact model approach; multiple abstraction domains; probabilistic compact model; reliability assessment; statistical compact model; subcircuit approach; CMOS technology; Circuit noise; Circuit simulation; Collision mitigation; Electronic design automation and methodology; MOSFETs; Maintenance; Predictive models; SPICE; Semiconductor device modeling; PCMOS; Xsim; circuit simulation; compact model; reliability; statistical; subcircuit; varibility;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-9-8108-2468-6
Type :
conf
Filename :
5403930
Link To Document :
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