• DocumentCode
    51194
  • Title

    Piezoelectric Actuators With Integrated High-Voltage Power Electronics

  • Author

    Yuen Kuan Yong ; Fleming, Andrew J.

  • Author_Institution
    Univ. of Newcastle, Callaghan, NSW, Australia
  • Volume
    20
  • Issue
    2
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    611
  • Lastpage
    617
  • Abstract
    This paper explores the possibility of piezoelectric actuators with integrated high-voltage power electronics. Such devices dramatically simplify the application of piezoelectric actuators since the power electronics are already optimized for the voltage range, capacitance, and power dissipation of the actuator. The foremost consideration is the thermal impedance of the actuator and heat dissipation. Analytical and finite-element methods are described for predicting the thermal impedance of a piezoelectric bender. The predictions are compared experimentally using thermal imaging on a piezoelectric bender with laminated miniature power electronics.
  • Keywords
    cooling; finite element analysis; infrared imaging; piezoelectric actuators; power integrated circuits; finite-element methods; heat dissipation; integrated high-voltage power electronics; laminated miniature power electronics; piezoelectric actuators; piezoelectric bender; power dissipation; thermal imaging; thermal impedance prediction; Heating; Impedance; Piezoelectric actuators; Power dissipation; Power electronics; Thermal analysis; Actuators; piezoelectric; power electronics;
  • fLanguage
    English
  • Journal_Title
    Mechatronics, IEEE/ASME Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4435
  • Type

    jour

  • DOI
    10.1109/TMECH.2014.2311040
  • Filename
    6778041