Title :
Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
Author :
Han, Hongtao ; Main, Keith
Author_Institution :
Tessera North America, 9815 David Taylor Drive, Charlotte, NC, USA 28262
Abstract :
Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.
Keywords :
Automotive engineering; Biomedical optical imaging; Costs; Digital cameras; Image sensors; Integrated optics; Manufacturing; Optical devices; Optical sensors; Wafer scale integration; Low Cost Camera; WLCSP; Wafer Bonding; Wafer Level Camera; Wafer Level Optics; Wafer Level Packaging; Wafer Scale Integration; Wafer Scale Optics;
Conference_Titel :
Communications and Photonics Conference and Exhibition (ACP), 2009 Asia
Conference_Location :
Shanghai, China
Print_ISBN :
978-1-55752-877-3
Electronic_ISBN :
978-1-55752-877-3
