Title :
Degradation-aware analog design flow for lifetime yield analysis and optimization
Author :
Pan, Xin ; Graeb, Helmut
Author_Institution :
Inst. for Electron. Design Autom., Tech. Univ. Muenchen, Munich, Germany
Abstract :
As integrated circuit technology scales down continuously, transistor parameters will shift from their nominal values due to process-induced variations and time-dependent degradations. While the former issue contributes directly to the production yield of the fresh circuit, the reliability issue will cause an additional yield loss during the lifetime. Thus the prediction of the circuit´s lifetime yield is highly necessary early in the design phase. Considering both process variation and lifetime degradation together, this paper presents a novel framework to analyze and optimize the lifetime yield value based on worst-case distances using exemplary state of the art reliability simulator and design centering software.
Keywords :
analogue integrated circuits; circuit CAD; circuit optimisation; integrated circuit design; integrated circuit reliability; circuit lifetime yield; degradation-aware analog design flow; design centering software; integrated circuit technology; lifetime degradation; lifetime yield analysis; optimization; process-induced variations; reliability; time-dependent degradations; transistor parameters; Algorithm design and analysis; Analog integrated circuits; Analytical models; Circuit simulation; Degradation; Design optimization; Integrated circuit yield; Manufacturing processes; Performance analysis; Software design;
Conference_Titel :
Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
Conference_Location :
Yasmine Hammamet
Print_ISBN :
978-1-4244-5090-9
Electronic_ISBN :
978-1-4244-5091-6
DOI :
10.1109/ICECS.2009.5410811