DocumentCode

513667

Title

Electroless Plating for Bump and Flip-Chip Technology

Author

Bruton, G. ; Morissey, A.

Author_Institution

National Microelectronics Research Centre, University College Cork, Ireland

fYear

1995

fDate

25-27 Sept. 1995

Firstpage

403

Lastpage

403

Keywords

Educational institutions; Microelectronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European

Conference_Location

The Hague, The Netherlands

Print_ISBN

286332182X

Type

conf

Filename

5435915