DocumentCode :
513667
Title :
Electroless Plating for Bump and Flip-Chip Technology
Author :
Bruton, G. ; Morissey, A.
Author_Institution :
National Microelectronics Research Centre, University College Cork, Ireland
fYear :
1995
fDate :
25-27 Sept. 1995
Firstpage :
403
Lastpage :
403
Keywords :
Educational institutions; Microelectronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
Conference_Location :
The Hague, The Netherlands
Print_ISBN :
286332182X
Type :
conf
Filename :
5435915
Link To Document :
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