• DocumentCode
    513762
  • Title

    Characterization and Modeling of Integrated Photosensors in Standard CMOS Technology

  • Author

    Baureis, Peter ; Gerber, Johannes

  • Author_Institution
    Siemens AG, ZFE-T-KM5, Otto-Hahn-Ring 6, D-81379 Mÿnchen
  • fYear
    1996
  • fDate
    9-11 Sept. 1996
  • Firstpage
    735
  • Lastpage
    738
  • Abstract
    This paper describes the electrical and spectral characteristics of different layers to construct photosensitive elements in standard 1,2 ¿m CMOS technology. The use of commercial CMOS processes guarantees good reproduceability of the integrated sensors and optimized cointegration with sensor signal conditioning circuits. Deep and shallow photosensitive PN diodes and a vertical PNP phototransistor are investigated. Electrical on wafer measurements with optical stimulation are performed and parameter extraction algorithms are established to create SPICE models. These models are suitable for the development of opto-ASICS. The validity of the model is tested using a 0,3 mm2 photodiode together with a two-stage transimpedance amplifier with a transimpedance of 5 M¿ at a 3 dB bandwidth of 90 kHz. The whole circuit is packaged using an optically transparent window in a plastic package.
  • Keywords
    CMOS process; CMOS technology; Diodes; Integrated circuit technology; Optical sensors; Plastic packaging; Semiconductor device modeling; Sensor phenomena and characterization; Signal processing; Stimulated emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
  • Conference_Location
    Bologna, Italy
  • Print_ISBN
    286332196X
  • Type

    conf

  • Filename
    5436040