DocumentCode
513808
Title
Elevated Base Single - Poly Self - Aligned BJTs for Deep Submicron BiCMOS
Author
Gravier, T. ; Maury, D. ; Kirtsch, I- ; Delpech, P. ; Pantel, R. ; Regolini, J.L. ; Chantre, A.
Author_Institution
France Telecom, CNET Grenoble, BP 98, F-38243 Meylan Cedex, France
fYear
1996
fDate
9-11 Sept. 1996
Firstpage
605
Lastpage
608
Abstract
This paper reports the fabrication of single-polysilicon self-aligned transistors using a 200mm 0.35¿m CMOS-derived bipolar process. An improved Ti salicidation process has been developed to minimize narrow emitter effects. Good device characteristics are demonstrated for 0.35¿m wide emitter devices, showing that this transistor structure can be extended to sub-0.5¿m BiCMOS.
Keywords
BiCMOS integrated circuits; CMOS technology; Dry etching; Electron emission; Fabrication; Implants; Morphology; Spontaneous emission; Telecommunications; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location
Bologna, Italy
Print_ISBN
286332196X
Type
conf
Filename
5436136
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