• DocumentCode
    513815
  • Title

    A New Multichip Package for Telecommunication Application

  • Author

    Lee, Y.M. ; Jang, D.H. ; Sun, Y.B.

  • Author_Institution
    Package Development, Samsung Electronics Co., Kiheung, Korea
  • fYear
    1995
  • fDate
    25-27 Sept. 1995
  • Firstpage
    817
  • Lastpage
    818
  • Keywords
    Application specific integrated circuits; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Plastic integrated circuit packaging; Plastic packaging; Sun; Testing; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
  • Conference_Location
    The Hague, The Netherlands
  • Print_ISBN
    286332182X
  • Type

    conf

  • Filename
    5436143
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=513815