Title :
Future Development in Electronic Systems is Impacted Both by Semiconductor Technology and IC Assembly Techniques
Author_Institution :
SGS-THOMSON Microelectronics, via Tolomeo 1, 20010 Cornaredo (Milano), Italy. E-mail: bruno.murari@st.com, Fax: + 39 2 93519 473
Abstract :
As integrated circuit processing technology progresses to deep submicron lithographies, designers increasingly adopt superintegrated approaches where several complex functions are combined on one die. At the same time, however, designers are now faced with choices in the approach to packaging: mixed IC technology and multichip packaging. This paper reviews these trends, presenting typical integrated circuits that exemplify each approach and compare their relative merits.
Keywords :
Assembly systems; Automotive electronics; CMOS technology; Cost function; Design methodology; Integrated circuit packaging; Integrated circuit technology; Lithography; Microelectronics; Silicon;
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location :
Bologna, Italy
