DocumentCode
513938
Title
Temperature non-uniformities in a silicon test square during rapid thermal processing
Author
O´Neill, A.G. ; Boys, D ; Jones, S K ; Hill, C.
Author_Institution
Department of Electrical and Electronic Engineering, University of Newcastle upon Tyne, NEI 7RU, UK
fYear
1990
fDate
10-13 Sept. 1990
Firstpage
69
Lastpage
72
Abstract
Rapid thermal processing of a small process square placed on a susceptor wafer of controlled emissivity is investigated. Under these conditions the process square is hotter than the susceptor wafer. Finite element modelling is compared with experimental data and used to predict the subsequently observed changes in process square temperature as its size and the condition of the susceptor wafer are changed.
Keywords
Finite element methods; Partial differential equations; Rapid thermal processing; Semiconductor device modeling; Silicon; System testing; Temperature control; Temperature distribution; Temperature measurement; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location
Nottingham, England
Print_ISBN
0750300655
Type
conf
Filename
5436400
Link To Document