Title :
A Novel Borosilicate Glass (SiOB-BSG) by Low Pressure Decomposition of a Monomolecular Liquid Precursor
Author :
Treichel, H. ; Becker, F.S. ; Fuchs, D. ; Kruck, T.
Author_Institution :
Siemens AG, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
Abstract :
BSG with constant composition (ca. 4.7 wt% B) was deposited using Tris(trimethylsiloxy) boron B[OSi(CH3)3] 3 in a standard LPCVD system. The optimum deposition conditions are 800 °C, 105 Pa (800 mTorr) and 280 sccm O2 purge. The films are chemically stable in atmosphere and exhibit good step coverage and low wet-etch rates. They are effective dopant sources in the 800-1000 °C range.
Keywords :
Atmosphere; Boring; Boron; Chemical technology; Corrosion; Glass; Ion implantation; Lattices; Silicon; Temperature;
Conference_Titel :
Solid State Device Research Conference, 1988. ESSDERC '88. 18th European
Conference_Location :
Montpellier, France