DocumentCode :
514186
Title :
Leakage Current Limitations of Trench Cell for 16M DRAMs
Author :
Roehl, S. ; Kusztelan, L ; Kuepper, P. ; Hasler, B.
Author_Institution :
Siemens AG, Components Group, Otto-Hahn-Ring 6, 8000 Muenchen 83, West Germany.
fYear :
1989
fDate :
11-14 Sept. 1989
Firstpage :
919
Lastpage :
922
Abstract :
One of the primary factors controlling 16M DRAM cell concept choice is that of sufficiently small leakage. Trench cell leakage to the substrate, to the adjacent trench and to neighboring transistor and bitline contact have been determined here for reduced geometry Trench Cells using a manufacturable 4M process. It is shown that the ``Super Shrink Trench Cell´´ is a viable 16M DRAM candidate insofar as leakage limitations are concerned.
Keywords :
Capacitors; Doping profiles; Etching; Geometry; Implants; Leakage current; Manufacturing processes; Random access memory; Transistors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location :
Berlin, Germany
Print_ISBN :
0387510001
Type :
conf
Filename :
5437069
Link To Document :
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