• DocumentCode
    514186
  • Title

    Leakage Current Limitations of Trench Cell for 16M DRAMs

  • Author

    Roehl, S. ; Kusztelan, L ; Kuepper, P. ; Hasler, B.

  • Author_Institution
    Siemens AG, Components Group, Otto-Hahn-Ring 6, 8000 Muenchen 83, West Germany.
  • fYear
    1989
  • fDate
    11-14 Sept. 1989
  • Firstpage
    919
  • Lastpage
    922
  • Abstract
    One of the primary factors controlling 16M DRAM cell concept choice is that of sufficiently small leakage. Trench cell leakage to the substrate, to the adjacent trench and to neighboring transistor and bitline contact have been determined here for reduced geometry Trench Cells using a manufacturable 4M process. It is shown that the ``Super Shrink Trench Cell´´ is a viable 16M DRAM candidate insofar as leakage limitations are concerned.
  • Keywords
    Capacitors; Doping profiles; Etching; Geometry; Implants; Leakage current; Manufacturing processes; Random access memory; Transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    0387510001
  • Type

    conf

  • Filename
    5437069