DocumentCode
514186
Title
Leakage Current Limitations of Trench Cell for 16M DRAMs
Author
Roehl, S. ; Kusztelan, L ; Kuepper, P. ; Hasler, B.
Author_Institution
Siemens AG, Components Group, Otto-Hahn-Ring 6, 8000 Muenchen 83, West Germany.
fYear
1989
fDate
11-14 Sept. 1989
Firstpage
919
Lastpage
922
Abstract
One of the primary factors controlling 16M DRAM cell concept choice is that of sufficiently small leakage. Trench cell leakage to the substrate, to the adjacent trench and to neighboring transistor and bitline contact have been determined here for reduced geometry Trench Cells using a manufacturable 4M process. It is shown that the ``Super Shrink Trench Cell´´ is a viable 16M DRAM candidate insofar as leakage limitations are concerned.
Keywords
Capacitors; Doping profiles; Etching; Geometry; Implants; Leakage current; Manufacturing processes; Random access memory; Transistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location
Berlin, Germany
Print_ISBN
0387510001
Type
conf
Filename
5437069
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