Title : 
Influences of Building Parameters on Over-cured Depth in Stereolithography System
         
        
            Author : 
Xu Guangshen ; Luo Sheng ; Ma Xunming ; Yang Jian
         
        
            Author_Institution : 
Sch. of Mech. Eng., Xi´an Polytech. Univ., Xi´an, China
         
        
        
        
        
        
        
            Abstract : 
In order to increase the building accuracy of microstructure in Z direction built with Stereolithography (SL) system, researches were carried to investigate the influences of factors on over-cured depth in SL process. The model of over-cured depth in SL process is established according to the characteristic of SL process, and experiments were conducted to prove the validity of the model with high-resolution SL system. It is found that main factors impacting over-cured depth are cured thickness of down-facing layer and the thickness of slice for 3D model of object. The smaller the cured thickness of down-facing layers and the larger the thickness of slice is, the smaller the over-cured depth is. It is also found that over-cured depth can be decreased through decreasing the ratio of laser power to scanning speed. The researches provide a base for increasing the building accuracy of microstructure in Z direction built with SL system.
         
        
            Keywords : 
curing; stereolithography; building parameters; over-cured depth; stereolithography system; Coils; Equations; Iron; Materials science and technology; Mathematical model; Production; Steel; Stereolithography; Stress; Strips; Building Parameters; building accuracy; over-cured depth; rapid prototyping; stereolithography;
         
        
        
        
            Conference_Titel : 
Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
         
        
            Conference_Location : 
Changsha City
         
        
            Print_ISBN : 
978-1-4244-5001-5
         
        
            Electronic_ISBN : 
978-1-4244-5739-7
         
        
        
            DOI : 
10.1109/ICMTMA.2010.149