• DocumentCode
    514721
  • Title

    Analyzing Properties of Pizeoelectric Substrates Incoporating Finite Element Method

  • Author

    Wang, Shumiing T. ; Chen, Shen-Whan ; Huang, Jen-Fa ; Lin, Chun-Chieh

  • Author_Institution
    Dept. of Electr. Eng., I-Shou Univ., Kaohsiung, Taiwan
  • Volume
    1
  • fYear
    2010
  • fDate
    13-14 March 2010
  • Firstpage
    578
  • Lastpage
    581
  • Abstract
    Surface acoustic wave (SAW) devices are of great interest for chemical and biochemical sensing applications. As the new piezoelectric materials are produced and the development of SAW device substrates expands from single-layer to multi-layer, analyzing the properties of piezoelectric substrates becomes more and more difficult. In this paper, a method that applies finite element (FEM) simulator to analyze piezoelectric substrates was developed. To verify the feasibility of the proposed method, the coupling-of-modes (COM) parameters of piezoelectric substrate were calculated and then applied to design a SAW device. The simulation result of the device is compared with that obtained by equivalent circuit model.
  • Keywords
    equivalent circuits; finite element analysis; piezoelectric materials; surface acoustic wave devices; analyzing properties; coupling-of-modes parameters; equivalent circuit model; finite element method; multi-layer; pizeoelectric substrates; single-layer; surface acoustic wave devices; Acoustic waves; Analytical models; Chemicals; Circuit simulation; Coupling circuits; Equivalent circuits; Finite element methods; Piezoelectric materials; Surface acoustic wave devices; Surface acoustic waves; coupling-of-modes; dispersionrelation; finite element method (FEM); surface acoustic wavedevices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
  • Conference_Location
    Changsha City
  • Print_ISBN
    978-1-4244-5001-5
  • Electronic_ISBN
    978-1-4244-5739-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2010.809
  • Filename
    5458840