Title :
The transition to chip-level optical interconnects
Author :
Haney, Michael W. ; Sparacin, Daniel K. ; Hodiak, Justin
Author_Institution :
Defense Adv. Res. Projects Agency, Arlington, VA, USA
Abstract :
The increasing bandwidth demands of computing chips have spawned significant research into chip-scale photonic interconnects. We review the DARPA-sponsored efforts at the inter- and intra-chip interconnect levels and highlight the key challenges to be addressed.
Keywords :
integrated optics; optical computing; optical interconnections; bandwidth demands; chip-level optical interconnects; chip-scale photonic interconnects; interchip interconnect level; intrachip interconnect level; photonic integrated circuit technologies; Bandwidth; Fabrics; Integrated circuit interconnections; Integrated circuit technology; Optical fiber communication; Optical interconnections; Optical signal processing; Optical waveguides; Packaging; Photonic integrated circuits;
Conference_Titel :
Optical Fiber Communication (OFC), collocated National Fiber Optic Engineers Conference, 2010 Conference on (OFC/NFOEC)
Conference_Location :
San Diego, CA
Electronic_ISBN :
978-1-55752-884-1
